Sichuan Hongxin FFKM Technology Co., Ltd.

Sichuan Hongxin FFKM Technology Co., Ltd.

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Sichuan Hongxin FFKM Technology Co., Ltd.

Sichuan Hongxin FFKM Technology Co., Ltd.

Sichuan Hongxin FFKM Technology Co., Ltd.

We Focus on the Production of Perfluoroelastomer Products or Perfluoro Rubber Products
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About Us

We Focus on the Production of Perfluoroether Rubber Products

Hongxin FFKM Technology Co., Ltd. was established in February 2022 with a registered capital of 10 million yuan and is located in Su Dongpo District, Meishan City, the hometown of Dongpo. It is a subsidiary of Sichuan Dowhon Group. The company is equipped with 1600 square meters of dust-free workshop and 300 square meters of dust-free R & D center with industrial standard pollution control, a complete dust-free workshop environment can provide the best quality products. For semiconductor customers, we can develop the most advanced perfluoroelastomer rubber to meet the most stringent quality and cleanliness requirements.
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2022 Year

Established in 2022

1600 ㎡

Dust-free workshop 1600 ㎡

10 Million Yuan

Registered capital 10 million yuan

300 ㎡

Dust-free R & D Center 300 ㎡

Sealing element
FFKM Compound
FFKM Precompound
FFKM Raw Gum

Sealing element

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FFKM O-rings are widely used in the assembly of important parts that require high strength fastening, such as bearings, nuts, bolts, gaskets, etc., which can effectively improve the performance of the parts and reduce the cost.

FFKM Compound

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With the development of oil extraction technology, drilling depth continues to increase, oil-bearing layer temperature can exceed 200 degrees C, crude oil mixed with a very high concentration of corrosive gases, in the oil field equipment using peroxide cross-linked perfluoroether rubber products can effectively reduce downtime and maintenance costs.

FFKM Precompound

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Perfluoroether premix glue is a kind of premix glue with vulcanizing agent/accelerator (Such as peroxide vulcanization). The material has specific application areas and advantages, such as its use in the semiconductor industry as an alternative to imported materials, showing its high performance and reliability. Perfluoroether premixed rubber has high chemical and heat resistance, can withstand up to 1600 kinds of chemical attack, and has excellent high temperature resistance, and can withstand a high temperature environment of 300°C. These characteristics make perfluoroether premixed rubber excellent in improving production efficiency and reducing maintenance costs, and are widely used in various occasions requiring high-performance sealing and corrosion resistance.

FFKM Raw Gum

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Perfluoroether rubber consists of a ternary copolymer of perfluorinated (methyl vinyl) ether, tetrafluoroethylene and crosslinked monomer,  also known as perfluoroether rubber. This material has excellent elasticity and thermal and chemical stability of PTFE. Its working temperature range is wide, long-term working temperature more than -10~315 degrees Celsius, short-term can reach 315 degrees Celsius, even below the brittle temperature, can still maintain a certain degree of plasticity, with hard but not brittle, bendable characteristics.

It consists of a ternary copolymer of perfluorinated (methyl vinyl) ether, tetrafluoroethylene and crosslinked monomer, ‌

FFKM O-ring

FFKM O-ring

FFKM O-ring

FFKM O-ring

FFKM O-ring

FFKM Compound

FFKM Compound

FFKM Compound

FFKM Compound

FFKM Compound

FFKM precompound

FFKM precompound

FFKM precompound

FFKM precompound

FFKM precompound

FFKM Raw Gum

FFKM Raw Gum

FFKM Raw Gum

FFKM Raw Gum

FFKM Raw Gum

Products

FFKM UltraPure seal

Learn more FFKM UltraPure seal

FFKM special-shaped seal ring

Learn more FFKM special-shaped seal ring

FFKM chemical resistant seal

Learn more FFKM chemical resistant seal

FFKM high temperature resistant seal

Learn more FFKM high temperature resistant seal

Application

Focus on the development and production of Perfluoroelastomer rubber O-rings

Semiconductor

Semiconductor

Aerospace

Aerospace

Petrochemical

Petrochemical

Photovoltaic industry

Photovoltaic industry

Food and Medical

Food and Medical

News

SEMICON 2025 - Hongxin Fluoroethers Invites You to View the World's Largest Semiconductor Exhibition!

2025-03-19

SEMICON 2025 - Hongxin Fluoroethers Invites You to View the World's Largest Semiconductor Exhibition!

An invitation from the semiconductor industry

"2024 to 2030 Deep Analysis and Development Trend Research Forecast Report on China's Perfluoroether Rubber (FFKM) Industry"

2025-01-17

"2024 to 2030 Deep Analysis and Development Trend Research Forecast Report on China's Perfluoroether Rubber (FFKM) Industry"

Dry etching and wet etching in semiconductor etching film processes are suitable for different specific scenarios. 1. **Dry Etching**: - **Applications**: Typically used for high-resolution patterning, such as in the fabrication of integrated circuits (ICs) and microelectromechanical systems (MEMS). - **Advantages**: Provides better control over etching profiles, allows for anisotropic etching (vertical etching), and is suitable for etching complex geometries. - **Common Techniques**: Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), and Plasma Etching. 2. **Wet Etching**: - **Applications**: Often used for bulk material removal, cleaning, and in processes where isotropic etching is acceptable, such as in the fabrication of certain types of sensors and optical devices. - **Advantages**: Generally simpler and less expensive than dry etching, and can be more effective for certain materials. - **Common Techniques**: Acid or alkaline solutions are used to etch materials like silicon, silicon dioxide, and metals. In summary, dry etching is preferred for applications requiring precision and complex patterns, while wet etching is suitable for simpler tasks and bulk material processing.

2025-01-08

Dry etching and wet etching in semiconductor etching film processes are suitable for different specific scenarios. 1. **Dry Etching**: - **Applications**: Typically used for high-resolution patterning, such as in the fabrication of integrated circuits (ICs) and microelectromechanical systems (MEMS). - **Advantages**: Provides better control over etching profiles, allows for anisotropic etching (vertical etching), and is suitable for etching complex geometries. - **Common Techniques**: Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), and Plasma Etching. 2. **Wet Etching**: - **Applications**: Often used for bulk material removal, cleaning, and in processes where isotropic etching is acceptable, such as in the fabrication of certain types of sensors and optical devices. - **Advantages**: Generally simpler and less expensive than dry etching, and can be more effective for certain materials. - **Common Techniques**: Acid or alkaline solutions are used to etch materials like silicon, silicon dioxide, and metals. In summary, dry etching is preferred for applications requiring precision and complex patterns, while wet etching is suitable for simpler tasks and bulk material processing.

In the semiconductor manufacturing process, etching is a critical step used to form the desired patterns on silicon wafers. Etching methods are mainly divided into dry etching and wet etching, each with different application scenarios and advantages and disadvantages. The following will explore the specific application scenarios of these two etching methods in detail. Application of Dry Etching 1. Etching of Fine Patterns Dry etching utilizes plasma for etching, which has high directionality and precision, making it very suitable for etching patterns that require high accuracy and high aspect ratios. For example, in the manufacturing of nanoscale transistor gates and advanced CMOS devices, dry etching can provide extremely high etching precision, ensuring the performance of the devices. 2. Etching of Multi-layer Structures Due to the good directional control of dry etching, it is particularly suitable for etching multi-layer film structures. In the manufacturing of three-dimensional integrated circuits (3D IC) or stacked memory, dry etching can achieve precise vertical etching, thereby forming complex multi-layer structures. 3. Etching of Materials with High Selectivity Dry etching can achieve highly selective etching of different materials by adjusting the composition and parameters of the plasma. This is especially important for etching composite materials. For example, in etching...

Typical semiconductor component: Vacuum system (1)

2024-12-09

Typical semiconductor component: Vacuum system (1)

What is the vacuum system commonly referred to in semiconductors? This article takes you into the semiconductor vacuum system!

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